项目名称： 封装效应对微加速度计稳定性影响的基础问题研究

项目编号： No.U1530132

项目类型： 联合基金项目

立项/批准年度： 2016

项目学科： 数理科学和化学

项目作者： 周吴

作者单位： 电子科技大学

项目金额： 63万元

中文摘要： 封装技术是高稳定性微加速度计的三大关键技术之一，封装引起的结构变形已成为限制微加速度计稳定性提升的最大障碍之一。为系统地研究封装效应与微加速度计稳定性的关系，本项目以“叉指”结构电容式微加速度计为对象，建立包括陶瓷基底-封装胶-玻璃的微加速度计封装模型，针对器件在高低温实验、长期贮存实验中的封装问题，基于封装胶材料特性与工艺力学行为，探索微加速度计敏感单元结构的小变形根源，研究封装影响稳定性的机理，阐明微加速度计稳定性与封装用胶的材料特性、固化工艺、结构参数等的关系，提出高稳定性微加速度计的封装胶选用原则及敏感单元结构优化方案，为微加速度计以及其它MEMS器件的封装稳定性设计提供理论参考。

中文关键词： 微加速度计；热应力；封装；可靠性；小变形

英文摘要： Packaging technology is one of the three key technologies of high stable micro accelerometers. The structure deformation induced by packaging has become one of the biggest obstacles to the stability improvement of micro accelerometers. In this project, the comb capacitive micro accelerometer is selected to systematically study the relationship between packaging effects and stability of micro accelerometers. According to the packaging problems encountered in the thermocycling test and long-term storage test of micro devices, the packaging model including ceramic substrate, packaging adhesive and glass is established to explore the sources of small deformation of sensitive unit structure based on the material properties and processing mechanics behaviors of packaging adhesive. Then the mechanism of influence of packaging on stability is studied to clarify the relationship of stability of micro accelerometers and the material properties, curing conditions and structure parameters of packaging adhesives, also to propose the principles of adhesive adoption and optimization scheme of sensitive unit structure to improve the stability of micro accelerometers. The achievements of this research can be used as theoretical guidelines on the stability design of micro accelerometers and other MEMS devices.

英文关键词： Micro accelerometer;Thermal stress;Packaging;Reliability;Small deformation