项目名称： 增强体对多场耦合下复合钎料焊点蠕变损伤的影响机理研究

项目编号： No.51505040

项目类型： 青年科学基金项目

立项/批准年度： 2016

项目学科： 机械、仪表工业

项目作者： 戴军

作者单位： 常熟理工学院

项目金额： 20万元

中文摘要： 复合钎料焊点因蠕变损伤而在多场耦合服役环境下易于失效。本项目拟通过构建多场耦合下的蠕变本构模型及可视化方法研究焊点蠕变过程以达到提高复合钎料焊点抗蠕变性能的目的。具体研究内容是（1）以SnCu基复合钎料为研究对象，构建力—热—电三场耦合的蠕变本构模型，建立各种复合钎料焊点的多场蠕变本构方程，探求增强体种类、尺度和含量对蠕变激活能和应力指数的影响规律；（2）通过可视化方法研究三场耦合下焊点蠕变过程中焊点的组织、界面金属间化合物、焊点内部空洞和裂纹演变规律；（3）探索增强体种类、尺度和含量对组织转变、界面金属间化合物生长、空洞演变和裂纹扩展的影响规律，提出改善复合钎料焊点蠕变损伤的手段，揭示增强体对多场耦合下复合钎料焊点蠕变损伤的影响机理。本项目的研究成果将为无铅焊点成分设计及提高焊点可靠性等方面提供理论基础和技术支撑。

中文关键词： 复合钎料；多场耦合；蠕变损伤；可靠性；可视化

英文摘要： Composite solder joints are prone to failure due to creep damage in multi-field coupling service environment. This project aims to build a creep process model through multi-field coupling and visualization methods in order to improve the creep resistance properties of the composite solder joints.The research contents are (1)The creep constitutive model in the coupling field of stress, temperature and electric is established. Creep constitutive equations are obtained based on the composite SnCu solder and creep constitutive model in the coupling field. Effects of kind, size and content of reinforcement on the creep activation energy and stress exponent are investigated;(2) Through the visualization method of organization, the interface of intermetallic compound, the void and crack evolution of the solder joint are studied;(3) Effects on evolution of microstructure, growth of interfacial intermetallic layer, evolution of interfacial voids and crack propagation of kind, size and content of reinforcement are studied. The influencing mechanism of reinforcement to the creep failure is revealed. The research results of this project will provide theoretical basis and technical support to the lead-free solder composition design and improve the reliability of solder joints.

英文关键词： composite solder;multi-field coupling;creep failure;reliability;visualization