项目名称： 新型微波金属化通孔耦合机制的建模与应用研究

项目编号： No.61501263

项目类型： 青年科学基金项目

立项/批准年度： 2016

项目学科： 无线电电子学、电信技术

项目作者： 秦伟

作者单位： 南通大学

项目金额： 21万元

中文摘要： 由于制作方便、电连接特性好，金属化通孔一直被广泛应用于微波电路中，如传输线接地、不同层电路的电连接等。然而金属化通孔的寄生效应在电路设计中不可避免，一直成为令人困扰的难题，尤其在高频段（如毫米波频段），这种效应更是不容忽视，需要做特殊处理或效应补偿。本项目将利用其寄生效应，研究金属化通孔在谐振器间耦合机制上的应用，提出金属化通孔耦合的概念，这既充分拓展金属化通孔在微波电路中的应用范围，又为微波带通滤波器设计提供更灵活的选择空间。主要研究内容包括：在单层印刷电路板（PCB）上深入研究金属化通孔耦合的耦合建模，设计具有单通带、双通带的带通滤波器，在金属化通孔旁并联一个变容二极管实现对耦合大小的电调节，从而设计带宽可调的高阶带通滤波器；利用三维加工技术，如低温共烧陶瓷（LTCC）工艺，研究多层结构上金属化通孔耦合的耦合建模，并设计微波单通带、双通带滤波器及双工器；完成以上器件的分析、加工与测试。

中文关键词： 金属化通孔；耦合机制；微波带通滤波器；带宽可调滤波器；三维加工技术

英文摘要： Metallic-vias have been widely applied in microwave circuits due to its easy fabrication process and excellent electric-connection characteristic. However, in such kind of application, the parasitic effect of the metallic-via is inevitable, which always appears to be a disturbing problem. It cannot be ignored and need to be processed and compensated in high frequency bands, especially in millimeter wave. Contrarily, this project aims to make use of its parasitic effect to investigate metallic-via’s application to the coupling between microwave resonators. Accordingly, the concept of metallic-via coupling mechanism is proposed, which can expand the usage of the metallic-via in microwave circuits to a great extent and flexibly provide more design choices for microwave bandpass filters. Firstly, the model of the single-layer metallic-via coupling will be constructed based on the printed circuit board (PCB). Secondly, it will be applied to design microwave bandpass filters with single/dual passbands, and a varactor will be parallel placed beside the metallic-via to electrically tune the amount of the coupling so that high-order bandpass filters with tunable bandwidth could be designed. Then, three-dimension (3-D) fabrication technologies, such as the low temperature co-fired ceramic (LTCC), will be made use of to investigate the characteristics of multi-layer metallic-via coupling, which will also be applied to the designs of microwave single-band/dual-band bandpass filters as well as diplexers. Last but not least, the designed devices will be well analyzed, fabricated and measured.

英文关键词： metallic-via;coupling mechanism;microwave bandpass filter;bandwidth-tunable filter;3-D fabrication technology