Piezoresistive tactile sensors are attractive for robotic manipulation because they are thin, lightweight, low-cost, and scalable to dense large-area sensing. However, existing systems still face a practical trade-off: recent reproducible designs emphasize accessibility and ease of reproduction, whereas high-fidelity readout architectures remain more difficult to fabricate, assemble, and deploy. We present HiPi, a reproducible high-fidelity piezoresistive sensing system for robotic manipulation. Building on a low-crosstalk readout principle, HiPi redesigns the complete hardware stack around reproducibility, deployability, and multi-sensor scalability. The system includes a compact readout PCB compatible with commercial PCB fabrication and assembly services, eliminating manual soldering; a smaller and lower-cost STM32-based MCU module; an optimized communication pipeline that achieves 220 Hz readout in a bimanual setup with four dense tactile arrays (2048 taxels in total); and FPCB-based conductive layers that simplify sensor fabrication and stacking. Experiments with structured 3D-printed contact patterns show that HiPi preserves contact geometry substantially better than a reproducible baseline, improving the average IoU from 0.428 to 0.797 and the average Dice score from 0.539 to 0.886. These results suggest that HiPi bridges an important gap between reproducible fabrication and high-fidelity readout, making dense piezoresistive tactile sensing more practical for bimanual manipulation and multi-fingered robotic systems.

翻译：摘要：压阻式触觉传感器因具备轻薄、低成本、可扩展至大面积密集传感等优势，在机器人操作领域备受关注。然而现有系统仍面临实际权衡：近期可重复设计虽强调可获取性与易复制性，但高保真读出架构在制造、组装与部署方面仍存在较大难度。本文提出HiPi——一种面向机器人操作的可重复高保真压阻式传感系统。基于低串扰读出原理，HiPi围绕可重复性、可部署性及多传感器可扩展性重新设计了完整硬件架构。该系统包含：兼容商业化PCB制造与装配服务的紧凑型读出电路板（无需手工焊接）；体积更小、成本更低的STM32微控制器模块；优化通信管线，可在配备四组密集触觉阵列（共2048个触觉单元）的双机械臂系统中实现220Hz读出速率；以及基于柔性电路板的导电层，简化传感器制作与叠层工艺。采用三维打印接触图案的实验表明，HiPi在还原接触几何特征方面显著优于可重复基准方案，平均交并比从0.428提升至0.797，平均Dice分数从0.539提升至0.886。这些结果表明，HiPi弥合了可重复制造与高保真读出之间的关键差距，使密集压阻触觉传感在双臂操作及多指机器人系统中更具实用价值。