Enhancing performance while reducing costs is the fundamental design philosophy of integrated circuits (ICs). With advancements in packaging technology, interposer-based chiplet architecture has emerged as a promising solution. Chiplet integration, often referred to as 2.5D IC, offers significant benefits, including cost-effectiveness, reusability, and improved performance. However, realizing these advantages heavily relies on effective electronic design automation (EDA) processes. EDA plays a crucial role in optimizing architecture design, partitioning, combination, physical design, reliability analysis, etc. Currently, optimizing the automation methodologies for chiplet architecture is a popular focus; therefore, we propose a survey to summarize current methods and discuss future directions. This paper will review the research literature on design automation methods for chiplet-based architectures, highlighting current challenges and exploring opportunities in 2.5D IC from an EDA perspective. We expect this survey will provide valuable insights for the future development of EDA tools for chiplet-based integrated architectures.

翻译：提升性能同时降低成本是集成电路（IC）的基本设计理念。随着封装技术的进步，基于中介层的芯粒架构已成为一种前景广阔的解决方案。芯粒集成，常被称为2.5D IC，具有显著优势，包括成本效益、可重用性以及性能提升。然而，实现这些优势在很大程度上依赖于有效的电子设计自动化（EDA）流程。EDA在优化架构设计、划分、组合、物理设计、可靠性分析等方面起着至关重要的作用。目前，优化芯粒架构的自动化方法是热门研究焦点；因此，我们提出一项综述，以总结现有方法并探讨未来方向。本文将回顾关于基于芯粒架构的设计自动化方法的研究文献，突出当前挑战，并从EDA视角探索2.5D IC中的机遇。我们期望本综述能为基于芯粒的集成架构的EDA工具未来发展提供有价值的见解。