An equation based reduced order model applicable to generalized heat equation and thermal simulations of power electronics systems developed in commercial CFD tools, is presented in this work. The model considers the physics of heat transfer between multiple objects in different mediums and presents a set of equations that can be applied to a wide range of heat transfer scenarios including conduction, natural and forced convection problems. A few case studies including heat transfer in a power electronic system are simulated in Ansys Icepak and the temperatures from the simulations are compared with the temperatures predicted by the models. The models are observed to be highly accurate when compared with the simulations. The predictive model described in this work reduces large complex simulations down to a few parameters which tremendously improves the computation speed, uses very low physical disk space and enables fast evaluation of thermal performance of the system for any changes in the input parameters.

翻译：本文提出一种基于方程降阶模型（ROM），适用于广义热方程以及商业CFD工具中电力电子系统的热仿真。该模型考虑了多物体在不同介质间的传热物理过程，并给出可适用于包括传导、自然对流与强迫对流问题在内的广泛传热场景的方程组。在Ansys Icepak中模拟了包含电力电子系统传热在内的若干案例，将仿真温度与模型预测温度进行比较。结果表明，模型与仿真高度吻合。本文描述的预测模型将大型复杂仿真简化为若干参数，显著提升计算速度，占用极低的物理磁盘空间，并能够快速评估输入参数变化时系统的热性能。