Shape memory structures are playing an important role in many cutting-edge intelligent fields. However, the existing technologies can only realize 4D printing of a single polymer or metal, which limits practical applications. Here, we report a construction strategy for TSMP/M heterointerface, which uses Pd2+-containing shape memory polymer (AP-SMR) to induce electroless plating reaction and relies on molecular dynamics, which has both shape memory properties and metal activity and information processing power. Through multi-material DLP 3D printing technology, the interface can be 3D selectively programmed on functional substrate parts of arbitrary shapes to become 4D electronic smart devices (Robotics). Microscopically, this type of interface appears as a composite structure with a nanometer-micrometer interface height, which is composed of a pure substrate layer (smart materials), an intermediate layer (a composite structure in which metal particles are embedded in a polymer cross-linked network) and a pure metal layer. The structure programmed by TSMP/M heterointerface exhibits both SMA characteristics and metal properties, thus having more intelligent functions (electroactive, electrothermal deformation, electronically controlled denaturation) and higher performance (selectivity of shape memory structures can be realized control, remote control, inline control and low voltage control). This is expected to provide a more flexible manufacturing process as platform technology for designing, manufacturing and applying smart devices with new concepts, and promote the development of cutting-edge industries such as smart robots and smart electronics.

翻译：形状记忆结构在许多前沿智能领域中发挥着重要作用。然而，现有技术仅能实现单一聚合物或金属的4D打印，这限制了实际应用。本文提出一种构建TSMP/M异质界面的策略：利用含Pd²⁺的形状记忆聚合物诱导化学镀反应，并借助分子动力学实现兼具形状记忆特性、金属活性及信息处理能力的界面。通过多材料DLP 3D打印技术，可在任意形状的功能基板部件上对界面进行选择性3D编程，从而制备出4D电子智能器件（机器人）。微观下，该界面呈现为具有纳米-微米级界面高度的复合结构，由纯基底层（智能材料）、中间层（金属颗粒嵌入聚合物交联网络的复合结构）及纯金属层组成。经TSMP/M异质界面编程的结构同时具备形状记忆合金特性与金属性能，因此具有更丰富的智能功能（电活性、电热变形、电控变性）及更优越的性能（可实现形状记忆结构的选择性控制、远程控制、在线控制及低电压控制）。该方法有望作为一种平台技术，为设计、制造和应用新概念智能器件提供更灵活的制造工艺，并推动智能机器人及智能电子等前沿产业的发展。