3D stacked technology has emerged as an effective mechanism to overcome physical limits and communication delays found in 2D integration. However, 3D technology also presents several drawbacks that prevent its smooth application. Two of the major concerns are heat reduction and power density distribution. In our work, we propose a novel 3D thermal-aware floorplanner that includes: (1) an effective thermal-aware process with 3 different evolutionary algorithms that aim to solve the soft computing problem of optimizing the placement of functional units and through silicon vias, as well as the smooth inclusion of active cooling systems and new design strategies,(2) an approximated thermal model inside the optimization loop, (3) an optimizer for active cooling (liquid channels), and (4) a novel technique based on air channel placement designed to isolate thermal domains have been also proposed. The experimental work is conducted for a realistic many-core single-chip architecture based on the Niagara design. Results show promising improvements of the thermal and reliability metrics, and also show optimal scaling capabilities to target future-trend many-core systems.

翻译：三维堆叠技术已成为克服二维集成中物理极限和通信延迟的有效机制。然而，三维技术也呈现出若干阻碍其顺利应用的缺陷，其中热耗散和功率密度分布是两个主要挑战。本研究提出一种新型三维热感知布图规划器，具体包括：（1）基于三种不同进化算法的高效热感知流程，旨在解决功能单元布局优化、硅通孔布置、主动冷却系统平滑集成及新型设计策略等软计算问题；（2）优化循环中集成的近似热模型；（3）主动冷却系统（液体通道）优化器；（4）基于气隙通道布局的新型热域隔离技术。实验基于Niagara架构的真实众核单芯片系统开展，结果表明该方案在热学与可靠性指标上取得显著改善，并展现出面向未来众核系统趋势的优异扩展能力。