Achieving long-range, high-rate, concurrent two-way mmWave communication with power-constrained IoT devices is fundamental to scaling future ubiquitous sensing systems, yet the substantial power demands and high cost of mmWave hardware have long stood in the way of practical deployment. This paper presents the first mmWave full-duplex backscatter tag architecture, charting a genuinely low-cost path toward high-performance mmWave connectivity and localization for ISAC systems. The proposed tag operates at ranges beyond 45m on the uplink and beyond 200m on the downlink, delivering 20x the reach of state-of-the-art systems while being over 100x cheaper than existing mmWave backscatter platforms. Enabling this leap is a novel low-power regenerative amplifier that provides 30 dB of gain while consuming only 30 mW, paired with a regenerative rectifier that achieves state-of-the-art sensitivity down to -60 dBm. We integrate our circuits on a compact PCB and evaluate it across diverse uplink and downlink scenarios, where it achieves an downlink BER of $10^{-1}$ at 200 meters and a uplink BER of $10^{-2}$ at 45 meters, demonstrating resilient, high-quality communication even at extended ranges.

翻译：实现功耗受限的物联网设备间的长距离、高速率、并发双向毫米波通信，是未来泛在感知系统规模化扩展的基础，然而毫米波硬件的高功耗与高成本长期以来阻碍了实际部署。本文提出了首个毫米波全双工反向散射标签架构，为ISAC系统实现高性能毫米波连接与定位开辟了一条真正的低成本路径。所提出的标签在上行链路可实现超过45米的通信距离，在下行链路则超过200米，其覆盖范围达到现有最先进系统的20倍，同时成本比现有毫米波反向散射平台低100倍以上。实现这一飞跃的关键在于一种新颖的低功耗再生放大器，它在仅消耗30 mW功率的情况下提供30 dB增益，并与一个可实现低至-60 dBm最先进灵敏度的再生整流器配对。我们将电路集成于紧凑的PCB板上，并在多种上行与下行链路场景中进行了评估。实验表明，该系统在200米距离处下行链路误码率可达$10^{-1}$，在45米距离处上行链路误码率可达$10^{-2}$，即使在远距离下也能实现稳健的高质量通信。