Environmental sustainability, driven by concerns about climate change, resource depletion, and pollution at local and global levels, poses an existential threat to Integrated Circuits (ICs) throughout their entire life cycle, particularly in manufacturing and usage. At the same time, with the slowing down of Moore's Law, ICs with advanced 3D and 2.5D integration technologies have emerged as promising and scalable solutions to meet the growing computational power demands. However, there is a distinct lack of carbon modeling tools specific to 3D and 2.5D ICs that can provide early-stage insights into their carbon footprint to enable sustainability-driven design space exploration. To address this, we propose 3D-Carbon, a first-of-its-kind analytical carbon modeling tool designed to quantify the carbon emissions of commercial-grade 3D and 2.5D ICs across their life cycle. With 3D-Carbon, we can predict the embodied carbon emissions associated with manufacturing without requiring precise knowledge of manufacturing parameters and estimate the operational carbon emissions owing to energy consumption during usage through surveyed parameters or third-party energy estimation plug-ins. Through several case studies, we demonstrate the valuable insights and broad applicability of 3D-Carbon. We believe that 3D-Carbon lays the initial foundation for future innovations in developing environmentally sustainable 3D and 2.5D ICs. The code and collected parameters for 3D-Carbon are available at https://anonymous.4open.science/r/3D-Carbon-9D5B/.

翻译：受气候变化、资源枯竭及本地与全球污染的驱动，环境可持续性对集成电路（IC）全生命周期（尤其是制造与使用阶段）构成生存性威胁。与此同时，随着摩尔定律放缓，采用先进3D与2.5D集成技术的IC已成为满足日益增长的计算能力需求的可扩展解决方案。然而，目前尚缺乏专门针对3D与2.5D IC的碳排放建模工具，无法为早期设计阶段提供碳足迹洞察以支持可持续驱动的设计空间探索。为此，我们提出3D-Carbon——首款面向商用级3D与2.5D IC全生命周期碳排放量化的解析建模工具。借助3D-Carbon，我们无需精确掌握制造参数即可预测制造阶段的本征碳排放，并通过调研参数或第三方能耗估算插件评估使用阶段因能源消耗产生的运营碳排放。多项案例研究表明，3D-Carbon可提供重要见解并具有广泛适用性。我们相信，3D-Carbon为开发环境可持续的3D与2.5D IC奠定了初步创新基础。3D-Carbon的代码与收集参数详见https://anonymous.4open.science/r/3D-Carbon-9D5B/。