In the early-stage design of advanced electronic packages, designers face a critical trade-off between simulation fidelity and computational turnaround time. Conventional early-stage methodologies typically achieve speed by relying on steady-state assumptions and structural homogenization. While computationally efficient, these approximations fundamentally fail to capture dynamic thermal events and stress concentrations at fine-grained internal interfaces, effectively masking failure mechanisms driven by transient signal bursts. In this work, we present a GPU-accelerated transient coupled Electromagnetic-Thermal-Mechanical solver that resolves this bottleneck. The proposed solver enables full-scale, non-homogenized, time-domain simulation of large-scale packages with runtimes amenable for rapid design iteration. Simulation of a NEC SX-Aurora TSUBASA package demonstrates that the tool allows for the identification of signal-induced adiabatic stress that is typically invisible to steady-state and homogenized baselines. This capability brings sign-off level physics fidelity to the early design phase, facilitating the prevention of costly late-stage design failures and broader transient thermal performance degradation risks.

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