In the early-stage design of advanced electronic packages, designers face a critical trade-off between simulation fidelity and computational turnaround time. Conventional early-stage methodologies typically achieve speed by relying on steady-state assumptions and structural homogenization. While computationally efficient, these approximations fundamentally fail to capture dynamic thermal events and stress concentrations at fine-grained internal interfaces, effectively masking failure mechanisms driven by transient signal bursts. In this work, we present a GPU-accelerated transient coupled Electromagnetic-Thermal-Mechanical solver that resolves this bottleneck. The proposed solver enables full-scale, non-homogenized, time-domain simulation of large-scale packages with runtimes amenable for rapid design iteration. Simulation of a NEC SX-Aurora TSUBASA package demonstrates that the tool allows for the identification of signal-induced adiabatic stress that is typically invisible to steady-state and homogenized baselines. This capability brings sign-off level physics fidelity to the early design phase, facilitating the prevention of costly late-stage design failures and broader transient thermal performance degradation risks.

翻译：在先进电子封装的早期设计阶段，设计者面临着仿真保真度与计算周转时间之间的关键权衡。传统的早期设计方法通常依赖稳态假设和结构均匀化来实现速度。虽然计算效率高，但这些近似从根本上无法捕捉动态热事件以及细粒度内部界面处的应力集中，从而掩盖了由瞬态信号突发驱动的失效机制。本文提出了一种GPU加速的瞬态耦合电磁-热-机械求解器，以解决此瓶颈。所提出的求解器能够对大规模封装进行全尺度、非均匀化的时域仿真，其运行时间适合快速设计迭代。对NEC SX-Aurora TSUBASA封装的仿真表明，该工具能够识别通常对稳态及均匀化基准方法不可见的信号诱导绝热应力。此能力将签核级物理保真度带入早期设计阶段，有助于预防代价高昂的后期设计故障以及更广泛的瞬态热性能退化风险。