项目名称： 基于自组装均聚物模板的自缓解型硅电极材料的构筑及其衰退机理研究

项目编号： No.61504080

项目类型： 青年科学基金项目

立项/批准年度： 2016

项目学科： 无线电电子学、电信技术

项目作者： 刘旭燕

作者单位： 上海理工大学

项目金额： 20万元

中文摘要： 电极材料硅在循环过程中，由于剧烈体积变化引起电极体积膨胀、容量衰竭的问题，使其在应用方面受到了极大的限制。而开发有序排列的电极微观结构可有效缓解其在充放电过程中的体积变化。考虑到各种制造问题，成本和安全性，本课题旨在研究一种有吸引力的新型的模版方法，即通过自组装均聚物模板来控制活性材料的结构。该项目拟开发一种高容量且长寿命的硅电极材料。拟利用均聚物模板在基板上镀上铜金属粒子矩阵，再通过气体沉降法镀上一层适当厚度的硅膜。通过增加硅与基板的粘结力和硅层的结构间隙来克服上述体积膨胀及易破碎脱落损耗等弊端。具有模板结构互逆的自缓解型硅电极的制备过程就是该课题的关键技术所在。此外，还将对均聚物模板形成的界面机理和硅电极各项电化学性能及其衰退机理进行深入的研究。最重要的是，此均聚物模板可以大批量、大面积的生产且其应用范围，并不仅限于半导体材料，具有极高的商业价值。

中文关键词： 自缓解型；硅电极；均聚物模板；衰退机理

英文摘要： Silicon anodes have limited applications because silicon’s volume changes upon insertion and extraction of lithium, which results in pulverization and capacity fading. And shape control of electrode active materials can solve this kind of problem. Taking into account various fabrication issues, cost, and safety, a process with an appealing alternative and forming certain types of patterning by homopolymers is provided. This project is expected to develop a high-performance electrode with minimized ohmic resistance by forming a homopolymer pattern of Cu foil as a current collector, forming patterned metallic seeds on the current collector by electroplating, forming a patterned Si electrode via vapor deposition according to the shape of the surface (contour coating), and modifying the surface of the electrode, represents one of the most promising solutions. In this way, the adhesion between the silicon and the substrate beneath was increased due to the increase of interfacial area via forming of silicon dome films. Moreover, patterned Cu/Si films were tested as electrodes for hybrid supercapacitors and their degradation mechanism and the interfacial mechanism of homepolymer patterns were studied. Most important, this kind method can be applied to large scale pruction, which is comparable to commercial values.

英文关键词： Tailoring self-relaxed;silicon eletrode;Homopolymer pattern;Degradation mechanism