Semiconductor manufacturing is a complex, multi-step process that requires both high precision and low operating costs. Therefore, detecting defects in a high-volume setting is an important component of wafer map analysis for reliable production. However, most state-of-the-art deep learning approaches require a full scan of the surface, which hinders the development of high-throughput inspection systems. To address this problem, we propose Uncertainty-aware Feedback Loop Diagnosis (UFLD), a novel algorithm that employs reinforcement learning for adaptive measurement acquisition and provides a prediction uncertainty level after each step, stopping the process once sufficient information is obtained. Unlike existing methods that rely on ensemble models or auxiliary confidence estimation deep learning models, UFLD utilizes a more parameter-efficient conformal prediction framework to determine the optimal stopping time. The proposed UFLD reduces acquisition time by about $40\%$ and achieves $98.4\%$ inspection accuracy, without requiring an additional learned confidence-estimation network. We validated our approach on the MixedWM38 dataset, demonstrating its advantages over existing adaptive acquisition procedures and standard convolutional neural networks.

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