项目名称： 功率半导体器件IGBT中Al金属化层损伤机理与疲劳寿命模型研究

项目编号： No.11502006

项目类型： 青年科学基金项目

立项/批准年度： 2016

项目学科： 数理科学和化学

项目作者： 安彤

作者单位： 北京工业大学

项目金额： 22万元

中文摘要： 针对功率半导体器件绝缘栅双极型晶体管（IGBT），采用实验、理论分析和数值模拟方法，研究IGBT芯片表面Al金属化层的微观-宏观力学行为，建立其分析模型。主要研究内容为：实验研究功率循环过程中Al金属化层微结构的演化规律，建立温度、循环次数与Al金属化层微结构演化之间的关系；发展一种可以描述Al金属化层微结构特点和力学行为的微观力学模型和宏观计算模型；提出Al金属化层失效评价指标和方法，建立考虑Al金属化层影响的IGBT模块疲劳寿命预测模型。将上述成果集成，应用于IGBT模块的热机械可靠性分析。研究目标为：给出Al金属化层在主要服役条件下力学行为的清晰图像，为IGBT模块的可靠性设计提供重要的科学依据、分析模型和工具，为IGBT模块产品的热机械可靠性设计提供建议。

中文关键词： IGBT模块；功率循环实验；Al金属化层；损伤机理；寿命预测

英文摘要： High power IGBT modules for industrial and traction applications are operated under severe working conditions and in harsh environments. Therefore, the reliability and lifetime of such devices is of great importance. Micro- and macro-mechanical behaviors of the Al-based metallization layer are investigated in this project by experimental, theoretical and numerical methods. In the project, the evolution of the microstructure of the Al metallization layer under power cycling test is monitored experimentally, and the relationship among temperature, cycle times and the microstructure of the Al metallization is investigated. Based on the experimental observations, a qualitative model including micro- and macro-mechanisms responsible for electrothermal ageing of the Al metallization is proposed. Failure analysis of Al metallization layers is carried out, and a model considering the effect of Al metallization for lifetime prediction of IGBT module is proposed. The models and methods derived finally are applied to analyze mechanical reliability of IGBT modules. Objectives of this project are to provide engineers on IGBT module technology with a clear picture of the micro- and macro-mechanical behaviors of the IGBT module, to provide models and tools for thermo-mechanical reliability design of IGBT module based devices.

英文关键词： IGBT module;power cycling test;Al metallization;damage mechanism;lifetime prediction