The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more features into the silicon footprint. One promising approach is Heterogeneous Integration (HI), which involves advanced packaging techniques to integrate independently designed and manufactured components using the most suitable process technology. However, adopting HI introduces design and security challenges. To enable HI, research and development of advanced packaging is crucial. The existing research raises the possible security threats in the advanced packaging supply chain, as most of the Outsourced Semiconductor Assembly and Test (OSAT) facilities/vendors are offshore. To deal with the increasing demand for semiconductors and to ensure a secure semiconductor supply chain, there are sizable efforts from the United States (US) government to bring semiconductor fabrication facilities onshore. However, the US-based advanced packaging capabilities must also be ramped up to fully realize the vision of establishing a secure, efficient, resilient semiconductor supply chain. Our effort was motivated to identify the possible bottlenecks and weak links in the advanced packaging supply chain based in the US.

翻译：半导体行业正经历从传统器件缩微与成本降低方法的重大转变。芯片设计者积极寻求新技术方案，以在硅片占位面积内集成更多功能的同时提高成本效益。异构集成（HI）是一种有前景的方法，它通过先进封装技术，集成采用最合适工艺独立设计与制造的各组件。然而，采用HI会带来设计与安全挑战。要实现HI，先进封装的研究与开发至关重要。现有研究提出了先进封装供应链中可能存在的安全威胁，因为大多数外包半导体组装与测试（OSAT）设施/供应商位于海外。为应对日益增长的半导体需求并确保安全的供应链，美国政府正大力推动半导体制造设施回归本土。但若要完全实现建立安全、高效、有韧性的半导体供应链的愿景，美国本土的先进封装能力也必须得到提升。本研究旨在识别美国先进封装供应链中可能的瓶颈与薄弱环节。