As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), the resulting complexity and manufacturing challenges continue to increase. In this context, 3D chiplet-based approaches have emerged as key enablers to address these limitations while exploiting the expanded design space. Specifically, chiplets help address the lower yields typically associated with large monolithic designs. This paradigm enables the modular design of heterogeneous systems consisting of multiple chiplets (e.g., CPUs, GPUs, memory) fabricated using different technology nodes and processes. Consequently, it offers a capable and cost-effective strategy for designing heterogeneous systems. This paper introduces the Horizon Europe Twinning project COIN-3D (Collaborative Innovation in 3D VLSI Reliability), which aims to strengthen research excellence in 2.5D/3D VLSI systems reliability through collaboration between leading European institutions. More specifically, our primary scientific goal is the provision of novel open-source Electronic Design Automation (EDA) tools for reliability assessment of 3D systems, integrating advanced algorithms for physical- and system-level reliability analysis.

翻译：随着半导体制造从3纳米工艺向亚纳米领域迈进，并从FinFET过渡到全环绕栅极场效应晶体管（GAAFET），由此产生的复杂性和制造挑战持续增加。在此背景下，基于三维芯粒的方法已成为应对这些限制并利用扩展设计空间的关键推动因素。具体而言，芯粒有助于解决通常与大型单片设计相关的较低良率问题。该范式支持由多个采用不同技术节点和工艺制造的芯粒（例如CPU、GPU、存储器）组成的异构系统的模块化设计。因此，它为设计异构系统提供了一种强大且具有成本效益的策略。本文介绍了“欧洲地平线”Twinning项目COIN-3D（三维超大规模集成电路可靠性的协同创新），该项目旨在通过欧洲顶尖机构间的合作，加强2.5D/3D超大规模集成电路系统可靠性方面的研究卓越性。更具体地说，我们的主要科学目标是提供用于三维系统可靠性评估的新型开源电子设计自动化（EDA）工具，集成用于物理级和系统级可靠性分析的先进算法。