The Bosch process is widely used in MEMS and TSV fabrication, but accurate prediction of etching outcomes remains difficult without calibration against real measurements, which are sparse and costly to obtain. This work presents a few-shot real-to-sim calibration framework that decouples simulator parameters from direct process variables to infer a recipe-specific simulator parameter vector from sparse measurements, enabling reliable prediction of etch depth and sidewall angle under held-out process conditions. We first formulate Bosch profile prediction as a few-shot real-to-sim calibration problem, where a small set of real XSEM measurements is used to identify a recipe-specific ViennaPS parameter vector $z_r^*$ that minimizes the discrepancy between simulated and measured etch depth and sidewall angle. To search this parameter space efficiently, the framework combines local exploration, LLM-guided candidate generation, and XGBoost-based surrogate screening, while retaining ViennaPS simulation as the final verification step for each selected candidate. Experiments on two Bosch etching recipes show that the proposed framework accurately predicts held-out etching results, achieving normalized global errors of 0.340 and 0.249 for the 2 recipes respectively.

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