The mobile phone has evolved from a simple communication device to a complex and highly integrated system with heterogeneous devices, thanks to the rapid technological developments in the semiconductor industry. Understanding the new technology is indeed a time-consuming and challenging task. Therefore, this study performs a teardown analysis of the Samsung Exynos S20 990 System-on-Chip (SoC), a flagship mobile processor that features a three-dimensional (3D) package on-package (PoP) solution with flip chip interconnect (fcPoP). The fcPoP design integrates the SoC and the memory devices in a single package, reducing the interconnection length and improving signal integrity and power efficiency. The study reveals the complex integration of various components and the advanced features of the SoC. The study also examines the microstructure of the chip and the package using X-ray, SEM, and optical microscopy techniques. Moreover, it demonstrates how the fcPoP design enables the SoC to meet the demands of higher performance, higher bandwidth, lower power consumption, and smaller form factor, especially in 5G mobile applications. The study contributes to understanding advanced packaging methodologies and indicates potential directions for future semiconductor innovations.

翻译：得益于半导体行业的快速发展，手机已从简单的通信设备演变为包含异构器件的复杂高集成度系统。理解新技术确实是一项耗时且具有挑战性的任务。因此，本研究对三星Exynos S20 990系统级芯片（SoC）进行了拆解分析。该芯片作为旗舰移动处理器，采用了带有倒装芯片互连的三维封装堆叠（fcPoP）解决方案。fcPoP设计将SoC与存储器件集成于单一封装内，从而缩短互连长度、提升信号完整性并改善能效。本研究揭示了该芯片内部各类元件的复杂集成方式及其先进特性，同时利用X射线、扫描电子显微镜（SEM）与光学显微技术分析了芯片及封装的微观结构。此外，研究还论证了fcPoP设计如何使SoC满足更高性能、更高带宽、更低功耗及更小尺寸的需求，特别是在5G移动应用中。本研究有助于理解先进封装方法，并为未来半导体创新指明了潜在方向。