In response to the growing demand for enhanced performance and power efficiency, the semiconductor industry has witnessed a paradigm shift toward heterogeneous integration, giving rise to 2.5D/3D chips. These chips incorporate diverse chiplets, manufactured globally and integrated into a single chip. Securing these complex 2.5D/3D integrated circuits (ICs) presents a formidable challenge due to inherent trust issues within the semiconductor supply chain. Chiplets produced in untrusted locations may be susceptible to tampering, introducing malicious circuits that could compromise sensitive information. This paper introduces an innovative approach that leverages blockchain technology to establish traceability for ICs and chiplets throughout the supply chain. Given that chiplet manufacturers are dispersed globally and may operate within different blockchain consortiums, ensuring the integrity of data within each blockchain ledger becomes imperative. To address this, we propose a novel dual-layer approach for establishing distributed trust across diverse blockchain ledgers. The lower layer comprises of a blockchain-based framework for IC supply chain provenance that enables transactions between blockchain instances run by different consortiums, making it possible to trace the complete provenance DAG of each IC. The upper layer implements a multi-chain reputation scheme that assigns reputation scores to entities while specifically accounting for high-risk transactions that cross blockchain trust zones. This approach enhances the credibility of the blockchain data, mitigating potential risks associated with the use of multiple consortiums and ensuring a robust foundation for securing 2.5D/3D ICs in the evolving landscape of heterogeneous integration.

翻译：为满足日益增长的高性能与高能效需求，半导体行业正经历向异质集成的范式转变，催生了2.5D/3D芯片的发展。这类芯片集成了全球制造、最终封装于单一芯片中的多样化芯粒。由于半导体供应链中固有的信任问题，确保这些复杂2.5D/3D集成电路的安全性面临严峻挑战。在非可信地点生产的芯粒可能易受篡改，从而引入可能泄露敏感信息的恶意电路。本文提出一种创新方法，利用区块链技术为集成电路及芯粒建立贯穿供应链的可追溯体系。鉴于芯粒制造商分布全球且可能隶属于不同的区块链联盟，确保各区块链账本中数据的完整性至关重要。为此，我们提出一种新颖的双层架构，用于在异构区块链账本间建立分布式信任机制。底层为基于区块链的集成电路供应链溯源框架，支持不同联盟运营的区块链实例间进行交易，从而实现对每个集成电路完整溯源有向无环图的追踪。上层实施多链信誉评估方案，为各参与实体分配信誉评分，并特别关注跨区块链信任域的高风险交易。该方法增强了区块链数据的可信度，降低了使用多联盟体系可能带来的潜在风险，为在不断发展的异质集成背景下保障2.5D/3D集成电路安全奠定了坚实基础。