项目名称： 倒装芯片微焊点微观组织不均匀性和电迁移行为之间的相互影响及作用机制研究

项目编号： No.51505095

项目类型： 青年科学基金项目

立项/批准年度： 2016

项目学科： 机械、仪表工业

项目作者： 秦红波

作者单位： 桂林电子科技大学

项目金额： 21万元

中文摘要： 倒装芯片封装由于高密度、高性能、轻薄小等优点成为电子封装技术的发展趋势。为满足高密度封装的要求，倒装芯片焊点尺寸持续减小，由此导致晶粒数量非常有限且微观组织呈明显不均匀性，同时造成焊点服役电流密度剧烈增加。本项目首先研究极小尺寸条件下倒装焊点回流焊接过程中焊点钎料体体积及几何结构对焊后微观组织共晶相和IMC相的大小、形态、分布及取向特征的影响，阐明焊点微观组织形态特征的尺寸效应，并建立焊点微观组织生长演化模型；然后，采用新颖方法对微观组织不同组成相的材料和物理性能进行试验测量，再通过电迁移试验揭示微焊点微观组织不同相中电迁移参数差异并阐明组织不均匀性对电迁移行为的影响，同时将基于试验建立的微观组织生长演化模型转换为包含不同相属性信息的有限元模型；最后，结合试验条件和测试结果，实现微观组织在电流载荷下的有限元求解分析及组织演变模拟，阐明微观组织不均匀性和电迁移行为之间的相互影响和作用机制。

中文关键词： 倒装芯片；微焊点；微观组织不均匀性；电迁移；可靠性

英文摘要： Flip chip packaging is the development tendency of electronic packaging for integrated circuit and electronic components because of advantages such as high density packaging, high performance and light in weight. With the increasing demands of high density packaging, the dimension of flip chip microscale solder joints is decreasing continuously, which induces the very limited grains, obvious microstructure inhomogeneity and high current density load. In the present project, the influence of solder volume and size on the microstructure characteristics of solder joint is studied, and physical models of phase growth and microstructure evolution will be clarified. Thereafter, new techniques and methods will be explored to investigate different physical and material properties of various phases in the microstructure. Meanwhile, microstructure of solder joint will be simulated by physical models of phase growth and microstructure evolution, and finite element models containing phase material attributes will be modeled accordingly. Finally, based on large amounts of experimental observation and testing data, finite element models containing microstructures will be solved and analyzed under current loads, and then interaction effects and mechanisms of action between microstructure inhomogeneity and electromigration behavior in microscale solder joints of flip chip packaging will be clarified.

英文关键词： Flip chip;microscale solder joint;microstructure inhomogeneity;electromigration;reliability