Background: Employee innovation is a crucial aspect of organizations in the current era. Therefore, studying the factors influencing individual innovation is vital and unavoidable. Undoubtedly, job satisfaction is a significant variable in management sciences. Nowadays, all organizations are interconnected with technology. Objective: This research explores the relationship between job satisfaction and individual innovation, including its components, and the moderating role of technostress. Research Method: This study, in terms of purpose, is applied, and in terms of data collection method, it is a descriptive survey. Data collection tools included the Technostress Inventory by Tarafdar and colleagues (2007), Janssen's Individual Innovation Questionnaire (2000), and the Job Satisfaction Survey (JSS) by Spector (1994). The validity and reliability of these questionnaires were confirmed. The sample size for this study was 215, and data analysis was performed using SPSS and SMART-PLS software. Findings: Job satisfaction has a significant and positive relationship with individual innovation, idea generation, idea promotion, and idea implementation. Technostress moderates the relationship between job satisfaction and individual innovation, as well as idea generation and idea promotion. However, technostress does not play a moderating role in the relationship between job satisfaction and idea implementation. Conclusion: Based on the obtained results, organizations should take necessary measures to increase job satisfaction and reduce technostress among their employees.

翻译：背景：员工创新是当前时代组织发展的关键环节。因此，探究影响个体创新的因素具有重要且不可回避的意义。毋庸置疑，工作满意度是管理科学领域的重要变量。当前所有组织均与技术紧密相连。目的：本研究旨在探索工作满意度与个体创新（含其构成要素）之间的关系，以及技术压力在此关系中的调节作用。研究方法：本研究从目的维度属于应用研究，从数据收集方法维度属于描述性调查。数据收集工具包括Tarafdar等学者（2007）编制的技术压力量表、Janssen（2000）编制的个体创新问卷（2000）以及Spector（1994）编制的工作满意度调查量表（JSS）。这些问卷的信度和效度均已得到验证。研究样本量为215，数据分析采用SPSS和SMART-PLS软件完成。发现：工作满意度与个体创新、创意产生、创意推广及创意实施均呈显著正相关。技术压力对工作满意度与个体创新、创意产生及创意推广之间的关系具有调节作用，但技术压力在工作满意度与创意实施的关系中未呈现调节效应。结论：基于研究结果，组织应采取必要措施提升员工工作满意度并降低其技术压力水平。