The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more features into the silicon footprint. One promising approach is Heterogeneous Integration (HI), which involves advanced packaging techniques to integrate independently designed and manufactured components using the most suitable process technology. However, adopting HI introduces design and security challenges. To enable HI, research and development of advanced packaging is crucial. The existing research raises the possible security threats in the advanced packaging supply chain, as most of the Outsourced Semiconductor Assembly and Test (OSAT) facilities/vendors are offshore. To deal with the increasing demand for semiconductors and to ensure a secure semiconductor supply chain, there are sizable efforts from the United States (US) government to bring semiconductor fabrication facilities onshore. However, the US-based advanced packaging capabilities must also be ramped up to fully realize the vision of establishing a secure, efficient, resilient semiconductor supply chain. Our effort was motivated to identify the possible bottlenecks and weak links in the advanced packaging supply chain based in the US.

翻译：半导体行业正经历从传统器件微缩与成本降低模式的重大转变。芯片设计者积极寻求新型技术解决方案，在增强成本效益的同时，于硅片面积内集成更多功能。异质集成（HI）作为一项颇具前景的方案，通过先进封装技术，将采用最适工艺技术独立设计与制造的组件集成在一起。然而，采用异质集成也带来了设计与安全方面的挑战。为实现异质集成，先进封装的研究与开发至关重要。现有研究指出了先进封装供应链中可能存在的安全威胁，原因是大多数外包半导体组装与测试（OSAT）设施/供应商位于海外。为应对日益增长的半导体需求，并确保半导体供应链安全，美国政府正大力推动将半导体制造设施迁回国内。但若要真正实现建立安全、高效、弹性半导体供应链的愿景，还需同步提升美国本土的先进封装能力。本研究旨在识别美国先进封装供应链中可能存在的瓶颈与薄弱环节。