Electromigration, a significant lifetime reliability concern in highperformance integrated circuits, is projected to grow even more important in future heterogeneously integrated systems that will service higher current loads. Today, EM checks are primarily based on rule-based methods, but these have known limitations. In recent years, there has been remarkable progress in enabling fast EM computations based on more accurate physics-based models, but such methods have not yet moved from research to practice. This paper overviews physics-based EM models, contrasts them with empirical models, and outlines several open problems that must be solved in order to enable accurate physics-based and circuit-aware EM analysis and optimization in future integrated systems.

翻译：电迁移作为高性能集成电路中一个重要的寿命可靠性问题，预计在未来承载更高电流负载的异质集成系统中将变得更为关键。目前，电迁移检查主要基于规则驱动的方法，但这些方法存在已知的局限性。近年来，基于更精确的物理模型实现快速电迁移计算的研究取得了显著进展，然而此类方法尚未从研究走向实际应用。本文综述了基于物理的电迁移模型，将其与经验模型进行对比，并阐述了为实现未来集成系统中精确的、具备电路感知能力的电迁移分析与优化所必须解决的若干开放性问题。