Modern system-in-package (SiP) platforms increasingly adopt reconfigurable interposers to enable plug-and-play chiplet integration across heterogeneous multi-vendor ecosystems. However, this flexibility introduces severe trust challenges, as traditional authentication schemes fail to scale or adapt in decentralized, post-fabrication programmable environments. This paper presents InterPUF, a compact and scalable authentication framework that transforms the interposer into a distributed root of trust. InterPUF embeds a route-based differential delay physically unclonable function (PUF) across the reconfigurable interconnect and secures authentication using multi-party computation (MPC), ensuring raw PUF signatures are never exposed. Our hardware evaluation shows only 0.23% area and 0.072% power overhead across diverse chiplets while preserving authentication latency within tens of nanoseconds. Simulation results using pyPUF confirm strong uniqueness, reliability, and modeling resistance under process, voltage, and temperature variations. By combining interposer-resident PUF primitives with cryptographic hashing and collaborative verification, InterPUF enforces a minimal-trust authentication model without relying on a centralized anchor.

翻译：现代系统级封装平台日益采用可重构中介层，以实现跨异构多供应商生态系统的即插即用芯粒集成。然而，这种灵活性带来了严峻的信任挑战，因为传统认证方案在去中心化、制造后可编程环境中难以扩展或适应。本文提出InterPUF，一种紧凑且可扩展的认证框架，将中介层转化为分布式信任根。InterPUF通过可重构互连结构嵌入基于路径的差分延迟物理不可克隆函数，并利用多方计算保障认证安全，确保原始PUF签名永不暴露。硬件评估表明，在不同芯粒上仅产生0.23%的面积开销与0.072%的功耗开销，同时将认证延迟保持在数十纳秒内。使用pyPUF的仿真结果证实，在工艺、电压和温度变化下具有优异的唯一性、可靠性与抗建模性。通过将中介层驻留的PUF原语与密码学哈希及协同验证相结合，InterPUF实现了不依赖中心化锚点的最小化信任认证模型。